Solder Lead-Free, ø 1.0 mm, 500 g
content: 0.3 % silver, 0.7 % copper, 99 % tin, content of flux core: 2.5 %, melting point 217° C
Solder Lead-Free, ø 1.0 mm, 500 g
content: 0.3 % silver, 0.7 % copper, 99 % tin, content of flux core: 2.5 %, melting point 217° C
Article details
In full flow: With its narrow diameter, the tin is easy to dispense and ideal for precision work, e.g. for soldering electrical components and devices such as printed circuit boards, SMDs, DIPs, cables, televisions, headphones or microphones. The integrated no-clean flux is particularly convenient, as you do not need to remove it from the joint after soldering.
- Flux-filled solder wire with a diameter of 1 mm, ideal e.g. for soldering electronics
- Simple, homogeneous wetting of the solder joint thanks to the rosin flux core
- No-clean solution with continuous flux cores that does not require cleaning the solder joint after use
- Reduced spattering for increased user safety and protection of the workpiece
- Halogen-free and with low smoke emission
- Perfect for soft soldering at low temperatures up to 450 °C in the automated and hand soldering area
Technical specifications
General
Packaging type
Bulk
Dimensions / Weight
Consumption Unit
1 pc. bulk
Diameter
1 mm
Weight
500 g
Downloads
Packing units:
1 / 10 / 40
Item: 40846
EAN: 4040849408465
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